We reported several times in the past few weeks that Samsung’s upcoming Galaxy S7 smartphone could be powered by Qualcomm’s newest Snapdragon 820 processor. Earlier this week, a Samsung phone codenamed Lucky-LTE appeared on the GeekBench benchmark, sporting Exynos 8890 chip. Inside sources told SamMobile that “Lucky” was the codename for the flagship Galaxy S7. Samsung chose that name because ‘7’ is considered a lucky number in many cultures.
Galaxy S7 prototype features 5.7-inch QHD display
And now Samsung’s Lucky phone has appeared on the AnTuTu benchmark, this time running Qualcomm’s Snapdragon 820 SoC. That’s in line with previous reports that Samsung may launch two versions of Galaxy S7, one with Snapdragon 820 and another with its in-house processor. The Korean electronics giant is currently testing Snapdragon 820, and hasn’t yet decided whether to use it in its next-gen device.
The Lucky prototype that appeared on AnTuTu benchmark features 16MP main camera, 5MP front-facing camera, 5.7-inch QHD display, 4GB RAM, and 64GB of internal storage. The prototype ran Android 5.1.1 Lollipop. Samsung will reportedly launch two versions of S7, one with a 5.2-inch display and another with a 5.7-inch screen. So the one spotted on AnTuTu is the bigger of the two.
Galaxy S7 may boast of 20MP camera, 6GB RAM
In the benchmark tests, Qualcomm’s Snapdragon 820 beat out both Snapdragon 810 and Exynos 7420 in the 3D test and single-threaded tests. But overall, Samsung’s Exynos 7420 was still on top with AnTuTu score of 72,355, compared to 65,775 for Snapdragon 820. Note that Qualcomm’s chip is still under development, so its final version is expected to show some improvement.
Sources told SamMobile that the final version of Galaxy S7 will feature 20MP ISOCELL camera rather than 16MP in the prototype. The phone is expected to retain the ultrafast UFS 2.0 storage of the Galaxy S6. Earlier this week, Samsung announced that it had started mass production of a new chip that would make it possible to use 6GB RAM in its future phones.
