Intel Corporation (NASDAQ:INTC) has apparently set the date for launching Haswell-E processor, according to leaked documents. The disclosed journals suggest September 14th 2014 would be the date when Intel will unveil its Haswell E series, which corresponds with the Intel’s imminent IDF 14 in San Francisco scheduled from 9 to 11 September.
PC makers need to make device compatible
VR-Zone’s Chinese language Portal cited the documents first revealing that at least three core i7 chips based on Haswell-E will be launched on September 14 other than Intel Corporation (NASDAQ:INTC)’s X99 chipset. The three Core i7 parts mentioned include the Core i7 5960X (8-core, 20MB L3 cache, 3GHz-3.5GHz), Core i7 5930K (6-core, 15MB L3 cache, 3.5GHz-3.7GHz), and the Core i7 5820K (6-core, 15MB cache, 3.3GHz-3.6GHz). All three reportedly carry a TDP of 140W and support Hyper-Threading.
The ExodusPoint Partners International Fund returned 0.36% for May, bringing its year-to-date return to 3.31% in a year that's been particularly challenging for most hedge funds, pushing many into the red. Macroeconomic factors continued to weigh on the market, resulting in significant intra-month volatility for May, although risk assets generally ended the month flat. Macro Read More
PC manufacturers planning to power desktop with Haswell E chip series would need to ensure that other parts of the PC are also compatible with the new microprocessor. Intel has added DDR4 memory to the new Haswell E, which is the biggest reason of excitement around the E family microprocessors. Haswell E will be the first chip from the house of Intel Corporation (NASDAQ:INTC) that will have eight cores carrying the Hyper-Threading technology. Other features include 20MB L3 cache, Quad-channel DDR4 memory controller (2133MHz maximum clock-rate) and 40 PCI Express 3.0 lanes
Other recent developments for Intel
Separately, during the 2014 International Supercomputing Conference, Intel Corporation (NASDAQ:INTC) made series of announcement including Knights Landing, the next-generation version of Xeon Phi. The forthcoming version of the micro-architecture will be three times faster than its previous version, and will include support for Intel’s next-generation fabric, code named Omniscale, and will feature Micron’s second-generation Hybrid Memory Cube technology.
Both Omniscale and Knights Landing will be unveiled next year in the second half of 2015, coinciding with the launch of next generations Xeons.
Intel Corporation (NASDAQ:INTC) is eager to manufacture chip for Apple iPhones and though iPhone 6 will not be powered by Intel chips, there are substantial possibilities that the chipmaker strikes a chord with Apple for next year’s iPhone, according to analyst Timothi Acuri of Cowen &Company. Acuri notes that Apple is looking for a cheaper deal with Intel compared to Qualcomm.