iPhone 7 To Use EMI Shielding To Boost Performance

Apple currently uses the electro-magnetic interference (EMI) technology on the printing circuit board and connector of the iPhone 6S. Now the tech giant is planning to use the technology to shield most of the major chips in the upcoming iPhone 7. Sources familiar with the matter told ETNews that it would help boost the iPhone 7’s performance and reduce the potential for electro-magnentic waves to interfere with processing chips.

iPhone 7 To Use EMI Shielding To Boost Performance

EMI coating to be applied to individual chips

In the next-gen iPhone, the EMI coating will be applied on the application chip A10, wireless chips (LAN, Bluetooth), radiofrequency and modem chips. Sources told ETNews that South Korean companies Amkor and StatsChipPac will be responsible for manufacturing the EMI shielding for the iPhone 7 line. The EMI shield is an ultra-thin layer of metal that reduces electro-magnetic interference. Apple already uses the EMI shielding technology for S1 chip package in the Apple Watch.

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Though putting an EMI cover on every single major chip in the iPhone 7 may not sound revolutionary, it would bring immense benefits. The first benefit concerns health, as it will reduce the electro-magnetic wave output. Reducing interference from chips will allow Apple to offer a better wireless experience like WiFi and cellular connectivity.

EMI shielding to help Apple increase iPhone 7 battery size

Moreover, individual EMI covers would help Apple create “more elaborate” and densely packed circuit boards, placing chips even closer together. It will make room for a larger battery and reduce the thickness of the iPhone 7. Apple is widely expected to reduce the thickness of the next iPhone to just 6-6.5mm. Using the EMI shielding will increase the cost of iPhone 7 production, but it would be worth the upgrade.

The next -gen iPhone 7 and 7 Plus are expected to arrive in September this year. The devices are rumored to feature A10 processor, 3D Touch, a dual-camera system, and waterproofing capabilities. The phones will get rid of the 3.5mm headphone jack, the protruding back camera, and antenna bands.