Intel Corporation (NASDAQ:INTC) has launched a technology DAAS- Display as a service, which according to Intel will change the way people use their gadgets. The debut technology from Intel will break the hard link between a video source and a screen in a similar way as the Visualization software broke the hard link between an operating system and a processor. The technology will let the people view what is on their tablet on a big screen TV. This technology will create the same image on multiple displays or can link multiple displays to create one large display.
The other potential technology, according to Divya Kolar of Intel Labs, will be to attach multiple device video on to a single screen which will make it easy for a family to work together on a multiple project. Intel revealed as well as showed the technology at the CeBIt trade show along with demonstrating a small box that can convert the technology to display without the need of any IP address.
By the end of this year, Intel Corporation (NASDAQ:INTC) is also prepping to launch earliest chips, known as Broadwell, which will shrink the Haswell design using the next-generation manufacturing process. Broadwell chips measure 14 nanometers (billionths of a meter), compared to 22nm in Ivy Bridge and Haswell chips.
“We’re going to be introducing the 14-nanometer technology at the end of this year and [will] start ramping it next year,” said Christian Morales, general manager of Intel Corporation (NASDAQ:INTC)’s operations in Europe, the Middle East, and Africa.
Intel Corporation (NASDAQ:INTC) launched another product- Prototype Windows 8 laptop sitting on upcoming fourth generation Core processor, called Haswell. There are only four prototypes of this model and the screen of this laptop can be detached with one hand. The Haswell, which will be available in systems in the mid of 2013, is built on the similar manufacturing process of today’s Ivy Bridge processors, although it will come with a new micro architecture. There have been no comments from Intel on the Haswell except guaranteeing better power management. But the consumer can expect to get better graphic performance with a bit faster processing.
A new manufacturing process was also unveiled, which will shift to silicon wafers of 450 mm size rather than 300 mm at present. The larger wafers reduce the per-chip cost of manufacturing because more processors can fit onto a single wafer.
“We want to go into 450mm wafers in the very near future,” Morales said. This transition is highly expensive as it requires all new manufacturing equipment. This new process was one of the reason as to why Intel has increased its capital expenditures, Morales said.