Apple’s upcoming iPhone 7 Plus has once again showed up in the rumor mill. Japanese magazine Mac Fan has leaked schematics of the 5.5-inch iPhone, confirming many of the previously rumored specs. According to the leak, the phone will have the same size as the iPhone 6S Plus, including the thickness. That seems a little confusing because Apple was rumored to remove the 3.5mm headphone jack to make it slimmer.
iPhone 7 Plus will be as thick as the iPhone 6S Plus
The schematics show the device featuring dual iSight cameras on the back, but there is no headphone jack. The rear camera space appears wider and oval-shaped. It’s in line with earlier rumors that the iPhone 7 Plus would sport a dual-lens design for enhanced image quality. It is still unclear how the dual-lens camera system would work. Also, the report says the iPhone 7 Plus will be 7.3mm thick, same as the iPhone 6S Plus, despite ditching the headphone jack.
Towards the bottom of the phone on the rear, you’ll see a Smart Connector port. It will allow customers to use Lightning-compatible headphones and charge the phone at the same time. The Smart Connector enables transfer of power and data simultaneously. Previously, there were rumors that a second speaker could replace the 3.5mm headphone jack. But the schematics suggest no such thing as a second speaker.
Apple’s big gamble
Apple is taking a big risk by retaining the design elements of the iPhone 6S and 6S Plus. Apple’s flagship phones have failed to excite consumers. As a result its quarterly revenue declined for the first time in more than a decade. KGI Securities analyst Ming-Chi Kuo said a few days ago that the iPhone 7 and 7 Plus will bring no major design changes. But the 2017 iPhone will see radical design overhaul with an all-glass chassis.
The schematics show that the antenna bands have been removed from the rear. However, it is unclear whether the schematics don’t show where they are hidden or they’ll be gone for good. Contrary to rumors, the camera bump is still there.
